Description
The RELIFE RL-403S 183℃ Solder Paste is a high-quality, low-melting-point solder paste designed for precise and reliable soldering in electronics repair and assembly. It is especially suitable for mobile phone repair and PCB rework applications.
Key Features:
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183℃ Melting Point: Ideal for low-temperature soldering, reducing the risk of component damage.
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Smooth & Consistent Texture: Ensures even application and strong solder joints.
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Excellent Wetting Performance: Provides clean, reliable connections with minimal residue.
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Low Residue Formula: Easy to clean after soldering.
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Convenient Syringe Packaging: Allows precise dispensing for detailed work.
Applications:
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Mobile phone and tablet repair
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PCB rework and BGA soldering
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SMD component installation
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