Description
A high-effect adhesive removal liquid specially formulated for mobile phone and electronics repair to soften and remove BGA/IC resin sealants, epoxy and hardened adhesives safely from circuit boards. It helps technicians remove stubborn glue around BGA chips, ICs, CPUs and other components without damaging the motherboard or sensitive parts.
Key Features:
• High-effect adhesive removal: Quickly softens and loosens cured resin and sealants used around BGA/IC components.
• Safe for electronics: Scientific, non-corrosive formula won’t harm the PCB, components or solder joints.
• Easy application: Liquid form makes it simple to apply precisely where needed with a pipette or dropper.
• Versatile use: Ideal for mobile phone mainboard rework, BGA/IC repair, underfill removal and epoxy glue softening.
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