Description
The RELIFE HW21S 183° Solder Paste is a high-quality, low-temperature soldering solution designed for precise electronic repair and PCB rework. With a melting point of 183°C, it helps reduce thermal stress on sensitive components while ensuring strong and reliable solder joints.
Key Features:
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183°C Low Melting Point: Ideal for heat-sensitive components.
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Smooth & Uniform Paste Texture: Ensures easy application and consistent results.
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Excellent Wetting Performance: Produces clean, strong solder joints.
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Low Residue Formula: Minimizes post-solder cleaning.
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Syringe Packaging with Tips: Allows accurate and controlled dispensing.
Applications:
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Mobile phone and electronics repair
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PCB rework and SMD soldering
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Precision soldering tasks
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