Description
The KOOCU 422 BGA Flux Paste is a professional-grade soldering flux tailored for advanced BGA (Ball Grid Array), QFN, and SMT rework and assembly applications. Designed with enhanced heat stability and superior solder wetting properties, this flux paste ensures smooth solder flow, minimizes defects, and helps create strong, reliable solder joints during precision reflow and reballing processes.
Ideal for electronics repair technicians and service centers, the KOOCU 422 Flux Paste effectively reduces oxidation and prevents bridging, making it perfect for high-temperature repair work on mobile phone motherboards, laptops, game consoles, and other intricate circuit boards. Its consistent paste texture allows for precise application and dependable results in demanding soldering environments.
Key Features
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Optimized for BGA & SMT: Excellent for BGA rework, reballing, and surface-mount component soldering.
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Superior Solder Wetting: Promotes improved solder flow and reliable joint formation.
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Oxidation Protection: Helps maintain clean surfaces and prevents oxidation under heat.
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High Thermal Stability: Performs reliably under high temperatures common in reflow applications.
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Professional Performance: Trusted by repair technicians for precision electronics work.
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