Description
The KOOCU 421 BGA Flux Paste is a professional soldering flux designed for advanced rework and assembly of BGA (Ball Grid Array), QFP, and other surface-mount components. Formulated for high thermal stability and excellent wetting performance, this flux paste enhances solder flow and promotes strong, reliable joints while reducing the risk of bridging and oxidation.
Perfect for mobile phone motherboard repair, laptop logic board rework, and other precision electronics tasks, the KOOCU 421 Flux Paste delivers consistent results in demanding soldering environments. Its easy-to-apply paste consistency ensures precise placement and effective performance during reflow and reballing applications.
Key Features
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Optimized for BGA & SMT: Ideal for BGA rework, reflow, and surface mount assembly.
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Improved Solder Flow: Enhances wetting and reduces surface tension for dependable joints.
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Oxidation Control: Helps prevent oxidation for cleaner soldering results.
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Heat Resistant: Performs reliably under high rework temperatures.
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Professional-Grade: Built for technicians and repair specialists.
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