BGA FLUX PASTE KOOCU 420

Description

The KOOCU 420 BGA Flux Paste is a high-performance soldering flux formulated specifically for BGA (Ball Grid Array) rework, surface mount technology (SMT), and advanced electronics repair. Designed to promote superior solder wetting and reduce surface tension, this flux helps ensure clean, reliable solder joints during reballing, reflow, and component placement processes.

With excellent heat stability and oxidation prevention, the KOOCU 420 Flux Paste enhances solder flow and minimizes defects such as bridging or voids, making it an essential tool for professional technicians working on mobile phone motherboards, laptops, game consoles, and other precision circuitry.

Key Features

• High-Performance Formula: Optimized for BGA, QFP, and SMT applications.

• Enhanced Solder Wetting: Improves solder flow for consistent, reliable joints.

• Oxidation Protection: Helps prevent surface oxidation during heating.

• Heat Stable: Performs well under high temperatures common in reflow and BGA work.

• Professional-Grade: Ideal for repair shops, rework stations, and electronics technicians.